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  Datasheet File OCR Text:
  100% material declaration data sheet for FFG1148 pk093 (v1.4) may 13, 2016 10.8691 g component substance description cas # or description % of component use in product component weight component % of total 0.694500 silicon 7440-21-3 100.000 0.694500 0.036115 tin 7440-31-5 63.000 0.022753 lead 7439-92-1 37.000 0.013363 0.074000 silica 60676-86-0 70.000 0.051800 epoxy resin a 9003-36-5 20.000 0.014800 epoxy resin b 25068-38-6 3.000 0.002220 hardener 19900-65-3 7.000 0.005180 6.000000 copper 7440-50-8 99.900 5.994000 nickel 7440-02-0 0.100 0.006000 0.130000 organopolysiloxane mixture na 100.000 0.130000 0.959000 tin 7440-31-5 95.500 0.915845 silver 7440-22-4 4.000 0.038360 copper 7440-50-8 0.500 0.004795 2.975310 copper 7440-50-8 50.17 metal layer 1.492713 tin 7440-31-5 0.76 metal layer 0.022612 lead 7439-92-1 0.15 metal layer 0.004463 silver 7440-22-4 0.02 0.000595 core n/a 34.56 1.028267 abf n/a 12.05 0.358525 solder mask n/a 2.30 0.068432 revision history date version description of revisions 03/14/2006 1.0 initial initial release. 06/01/2006 1.1 100% material declaration. 09/27/2006 1.2 updated component descriptions. 07/20/2010 1.3 updated heat spreader substance description 05/13/2016 1.4 updated substrate notice of disclaimer 55.203% 1.196% 8.823% 27.375% average weight : 6.390% 0.332% 0.681% xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third-party vendors and materials suppliers (contractors). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . silicon die solder bump underfill heat spreader heat spreader adhesive solder ball substrate ? copyright 2016 xilinx


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